陶瓷基片，又稱陶瓷基板，是以電子陶瓷為基底，對膜電路元件及外貼切元件形成一個支撐底座的片狀材料。
　　按照陶瓷基片應用領域的不同，又分為HIC（混合集成電路）陶瓷基片、聚焦電位器陶瓷基片、激光加熱定影陶瓷基片、片式電阻基片、網絡電阻基片等；按加工方式的不同，陶瓷基片分為模壓片、激光劃線片兩大類。
模壓片
主要特點
　　陶瓷基片具有耐高溫、電絕緣性能高、介電常數和介質損耗低、熱導率大、化學穩定性好、與元件的熱膨脹系數相近等主要優點，但陶瓷基片較脆，制成的基片面積較小，成本高。
發展方向
　　隨著微電子技術的進步，微加工工藝的特征線寬已達亞微米級，一塊基板上可以集成106～109個以上元件，電路工作的速度越來越快、頻率越來越高，這對基板材料的性能提出了更高的要求。作為混合集成電路（HIC）和多芯片組件（MCM）的關鍵材料之一，基板占其總成本的60%左右。陶瓷基板發展的總方向是低介電常數、高熱導率和低成本化。
　　目前，實際生產和開發應用的陶瓷基片材料有Al2O3、AlN、SiC、BeO、BN、莫來石和玻璃陶瓷等。其中，BeO和SiC熱導率很高（&sup3;250W/m.K），但BeO因具有毒性，應用范圍小，故產量低；SiC因體積電阻較小（<1013W·cm）、介電常數較大（40）、介電損耗較高（50），不利于信號的傳輸，且成型工藝復雜、設備昂貴，故應用范圍也很小；AlN陶瓷基片是新一代高性能陶瓷基片，具有很高的熱導率（理論值為319W/m.K，商品化的AlN基片熱導率大于140W/m.k）、較低的介電常數（8.8）和介電損耗（～4×104）、以及和硅相配比的熱膨脹系數（4.4×10－4/℃）等優點，但由于成本居高，一直沒能大規模應用；Al2O3陶瓷基片雖然熱導率不高（20W/m.K），但因其生產工藝相對簡單，成本較低，價格便宜，成為目前最廣泛應用的陶瓷基片。
  
劃線片
編輯本段制備工藝
深圳市的美科技電子陶瓷有限公司一般采用流延成型法制備氧化鋁陶瓷基片，目前發展到使用非苯系、無毒、無公害溶劑體系，對環境無污染，且流延坯片的干燥速率易于控制，配料中使用的溶劑可回收循環利用。在流延生坯上可以沖制各種形狀和孔，然后進行燒成，可在連續式空氣氣氛窯爐中同時完成排膠和燒成的生產方式。96%氧化鋁陶瓷基片材料中添加了合適的礦物原料作為助熔劑，燒成溫度低到1580℃~1600℃，產品密度即可達3.75g/cm3以上。對于尺寸精度要求較高的產品，可以在燒成后，以激光加工方法，在基片上劃線、打孔，精度達到±0.05mm。
 
 
Ceramic substrate, also called ceramic substrates, electronic ceramic substrate is for, to film circuit components and the appropriate elements to form a support base, sheet material. According to the different of the application of ceramic substrate, and divided into HIC (hybrid integrated circuit) ceramic substrate, the focus potentiometer ceramic substrate, the laser heating fuser ceramic substrate, the chip resistor substrate, the network resistors substrate, etc.; According to the different methods of processing, ceramic substrate is divided into moulding piece, laser crossed piece two kinds big. Moulded piece of
The main features of high-temperature ceramic substrate, electric insulation performance is high, dielectric constant and medium loss, low thermal conductivity, good stability, and chemical components such as thermal expansion coefficient of similar major advantages, but brittle ceramic substrate, the area more ? made substrate
The main features
Ceramic substrate with high temperature, electric insulation performance is high, dielectric constant and medium loss, low thermal conductivity, good stability, and chemical components such as thermal expansion coefficient of similar major advantages, but brittle ceramic substrate, made of substrate area is lesser, high cost.
Development direction
Along with the progress of the microelectronics technology, the processing technology of the characteristic line width has reached a sub-micron, a piece of substrate can be integrated 106 ~ 109 more elements, circuit to work faster and faster, higher frequency, the substrate materials performance put forward higher request. As a hybrid integrated circuit cracking (HIC) and multichip module (MCM) one of the key materials, boards of its total cost of about 60%. Ceramic substrates development direction is always low dielectric often ?
The beauty of shenzhen science and technology electronic ceramics Co., LTD. General use of the flow ChengXingFa alumina ceramic substrate delay preparation, the present development to use the benzene department, non-toxic, pollution-free solvent systems, free from pollution to the environment, and the flow of billet delay the drying rate of easy to control, ingredients used in solvent recovery recycling. In the flow can be blunt the green delay of various shapes and hole, then firing, can be in the continuous air atmosphere in kiln finish at the same time row glue and firing mode of production. 96% alumina ceramic substrate materials added to the mineral right as raw material flux, firing temperature to 1580℃~ 1600 low℃, the product can reach 3.75 g density/cm3 above. For size higher accuracy of products, can be in after firing, with the laser processing methods, in the substrate, punch crossed
 
Circuit board with ceramic substrate
Alumina ceramic substrate is a superconducting hot, the thermal insulation material compression. Coefficient of thermal conductivity 25 W/m.K, compression is 12000 V or so. Is the first thermal power equipment.
Mainly used in high power devices have the IC, MOS tube, IGBT thermal insulation effect patch type. High frequency power supply IC, communication, mechanical equipment used for strong current, voltage, high temperature super strong thermal insulation parts of the need. Have a better function auxiliary function. Let\'s play better equipment performance.
Physical properties for high thermal conductivity and high voltage insulator, high temperature resistant, wear resistance, high strength.
Can be customized maximum size 180 * 200 MM or so, thickness of 0.5-10 MM; Alumina material: 96%, 99%;
Features:
1, thermal resistance 0.3 degrees-IN square/W (@ 50 PSI)
2, the thermal conductivity 25 W/m.K high thermal insulation 12 KV voltage and the high insulation resistance
3, high strength alumina ceramic substrate
4, stable performance effective solution because of poor heat dissipation, and cause IC aging
Common specification: prearcing-220, 247,, and the prearcing-prearcing-264, etc
Regular size (unit MM) : 20 * 26* 1, 2 have holes, 22 * 28 * 1 have holes, 24 * 18.5 *0.63 there are holes, and 24*18.5*0.63, etc. May according to the customer request processing drawings.
96% alumina ceramic substrate, used in the electronic components are the encapsulation, electroplating, thermal insulation, strong resistance to pressure current and other products.
Circuit board with ceramic substrate adopts the high quality 96-99% alumina ceramic materials, high strength, high temperature resistance, corrosion resistance, resistance to oxidation, high life etc. Characteristics.
LED lamp kind ceramic substrate, can add ceramic surface and a meta