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參數資料
| 型號： | TPA0112PWPR |
| 元件分類： | 運動控制電子 |
| 英文描述： | AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC |
| 中文描述： | 音頻放大器|雙|的CMOS | TSSOP封裝| 24針|塑料 |
| 文件頁數： | 18/34頁 |
| 文件大小： | 488K |
| 代理商： | TPA0112PWPR |
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TPA0112
2-W STEREO AUDIO POWER AMPLIFIER
WITH FOUR SELECTABLE GAIN SETTINGS
SLOS204B – MAY 1999 – REVISED MARCH 2000
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see Figure 41)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (<2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
Figure 41. Views of Thermally Enhanced PWP Package
APPLICATION INFORMATION
selection of components
Figure 42 and Figure 43 are a schematic diagrams of typical notebook computer application circuits.
相關PDF資料 |
PDF描述 |
|---|---|
| TPA0132PWPR | AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC |
| TPA0142PWPR | Dual Audio Amplifier |
| TPA0152PWPR | Dual Audio Amplifier |
| TPA0162PWPR | AUDIO AMPLIFIER|DUAL|CMOS|TSSOP|24PIN|PLASTIC |
| TPA0122PWP | CONNECTOR ACCESSORY |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TPA0112PWPRG4 | 功能描述:音頻放大器 St 2W APA With Int Gain Settings RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0122 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:2-W STEREO AUDIO POWER AMPLIFIER WITH FOUR SELECTABLE GAIN SETTINGS |
| TPA0122EVM | 功能描述:音頻 IC 開發工具 TPA0122 Eval Mod RoHS:否 制造商:Texas Instruments 產品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| TPA0122PWP | 功能描述:音頻放大器 2W Stereo A RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA0122PWPG4 | 功能描述:音頻放大器 2W Stereo A RoHS:否 制造商:STMicroelectronics 產品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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