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參數資料
| 型號： | TSL1401CS-LF |
| 廠商： | AMS-TAOS USA Inc |
| 文件頁數： | 15/19頁 |
| 文件大小： | 680K |
| 描述： | IC OPTO SENSOR ARRAY CSP PCB MT |
| 標準包裝： | 1 |
| 系列： | * |
| 其它名稱： | TSL1401-CS-LFDKR |
TSL1401CSLF
128 ?1 LINEAR SENSOR ARRAY WITH HOLD
TAOS072E APRIL 2007
14
r
r
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
This product, in the solder bump linear array package, has been tested and has demonstrated an ability to be
reflow soldered to a PCB substrate. The process, equipment, and materials used in these tests are detailed
below.
Tooling Required
D Solder stencil (round aperture size 0.36 mm, stencil thickness of 152.4 ?/SPAN>m)
D 20 ?SPAN class="pst TSL1401CS-LF_2587633_6"> 20 frame for solder stencil
Process
1. Apply solder paste using stencil
2. Dispense adhesive dots
3. Place component
4. Reflow solder/cure
5. X-Ray verify
Placement of the TSL1401CSLF device onto the gold immersion substrate is accomplished using a standard
surface mount manufacturing process. First, using the stencil with 0.36 mm square aperture, print solder paste
onto the substrate. Next, dispense two 0.25 mm to 0.4 mm diameter dots of adhesive in opposing corners of
the TSL1401CSLF mounting area. Machine place the TSL1401CSLF from the JEDEC waffle carrier onto the
substrate. A suggested pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has
a rubber tip with a diameter of approximately 0.75 mm. The part is picked up from the center of the body. Reflow
the solder and cure the adhesive using the solder profile shown in Figure 14.
The reflow profiles specified here describe expected maximum heat exposure of components during the solder
reflow process of product on a PWB. Temperature is measured at the top of component. The components
should be limited to one pass through the solder reflow profile used.
Table 1. TSL1401CSLF Solder Reflow Profile
PARAMETER
REFERENCE
TSL1401CSLF
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above T
1
, 217癈
t
1
Max 60 sec
Time above T
2
, 230癈
t
2
Max 50 sec
Time above T
3
, (T
peak
10?/SPAN>C)
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260癈 (0癈/+5癈)
Temperature gradient in cooling
Max 5癈/sec
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