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參數資料
| 型號： | TSPC750AMGSU12LH |
| 元件分類： | 微處理器 |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數： | 19/44頁 |
| 文件大小： | 870K |
| 代理商： | TSPC750AMGSU12LH |
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TSPC750A/740A
2128A–HIREL–01/02
Assuminganairvelocityof0.5m/s,wehaveaneffectiveR
sa
of7
°
C/W,thus
T
j
=30°C+5°C+(2.2°C/W+1.0°C/W+7°C/W)*4.5W,
resultinginadie-junctiontemperatureofapproximately81°Cwhichiswellwithinthe
maximumoperatingtemperatureofthecomponent.
OtherheatsinksofferedbyChipCoolers,IERC,Thermalloy,WakefieldEngineering,
andAavidEngineeringofferdifferentheatsink-to-ambientthermalresistances,andmay
ormaynotneedairflow.
Thoughthediejunction-to-ambientandtheheatsink-to-ambientthermalresistances
areacommonfigure-of-meritusedforcomparingthethermalperformanceofvarious
microelectronicpackagingtechnologies,oneshouldexercisecautionwhenonlyusing
thismetricindeterminingthermalmanagementbecausenosingleparametercanade-
quatelydescribethree-dimensionalheatflow.Thefinaldie-junctionoperating
temperature,isnotonlyafunctionofthecomponent-levelthermalresistance,butthe
system-leveldesignanditsoperatingconditions.Inadditiontothecomponent’spower
consumption,anumberoffactorsaffectthefinaloperatingdie-junctiontemperature-air-
flow,boardpopulation(localheatfluxofadjacentcomponents),heatsinkefficiency,
heatsinkattach,heatsinkplacement,next-levelinterconnecttechnology,systemair
temperaturerise,altitude,etc.
Duetothecomplexityandthemanyvariationsofsystem-levelboundaryconditionsfor
today’smicroelectronicequipment,thecombinedeffectsoftheheattransfermecha-
nisms(radiation,convectionandconduction)mayvarywidely.Forthesereasons,we
recommendusingconjugateheattransfermodelsfortheboard,aswellas,system-level
designs.Toexpeditesystem-levelthermalanalysis,several“compact”thermal-package
modelsareavailablewithinFLOTHERM
.Theseareavailableuponrequest.
PowerConsideration
PowerManagement
TheTSPC750Aprovidesfourpowermodes,selectablebysettingtheappropriatecon-
trolbitsintheMSRandHIDOregisters.Thefourpowermodesareasfollows:
Full-power:ThisisthedefaultpowerstateoftheTSPC750A.TheTSPC750Aisfully
poweredandtheinternalfunctionalunitsareoperatingatthefullprocessorclock
speed.Ifthedynamicpowermanagementmodeisenabled,functionalunitsthatare
idlewillautomaticallyenteralow-powerstatewithoutaffectingperformance,
softwareexecution,orexternalhardware.
Doze:AllthefunctionalunitsoftheTSPC750Aaredisabledexceptforthetime
base/decrementerregistersandthebussnoopinglogic.Whentheprocessorisin
dozemode,anexternalasynchronousinterrupt,asystemmanagementinterrupt,a
decrementerexception,ahardorsoftreset,ormachinecheckbringsthe
TSPC750Aintothefull-powerstate.TheTSPC750Aindozemodemaintainsthe
PLLinafullypoweredstateandlockedtothesystemexternalclockinput
(SYSCLK)soatransitiontothefull-powerstatetakesonlyafewprocessorclock
cycles.
Nap:Thenapmodefurtherreducespowerconsumptionbydisablingbussnooping,
leavingonlythetimebaseregisterandthePLLinapoweredstate.TheTSPC750A
returnstothefull-powerstateuponreceiptofanexternalasynchronousinterrupt,a
systemmanagementinterrupt,adecrementerexception,ahardorsoftreset,ora
machinecheckinput(MCP).Areturntofull-powerstatefromanapstatetakesonly
afewprocessorclockcycles.Whentheprocessorisinnapmode,ifQACKis
negated,theprocessorisputindozemodetosupportsnooping.
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相關代理商/技術參數 |
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|---|---|
| TSPC750AMGSU8LE | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| TSPC750AMGSU8LH | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| TSPC750AMGU/T10LE | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| TSPC750AMGU/T10LH | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| TSPC750AMGU/T12LE | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
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