
30
TSPC750A/740A
2128A–HIREL–01/02
Figure20providesthetestaccessporttimingdiagram.
Figure20.
TestAccessPortTimingDiagram
Preparationfor
Delivery
Packaging
MicrocircuitsarepreparedfordeliveryinaccordancewithMIL-PRF-38535.
CertificateofCompliance
ATMEL-Grenobleoffersacertificateofcomplianceswitheachshipmentofparts,affirm-
ingtheproductsareincomplianceeitherwithMIL-PRF-883andguaranteeingthe
parametersnottestedattemperatureextremesfortheentiretemperaturerange.
Handling
MOSdevicesmustbehandledwithcertainprecautionstoavoiddamageduetoaccu-
mulationofstaticcharge.Inputprotectiondeviceshavebeendesignedinthechipto
minimizetheeffectofstaticbuildup.However,thefollowinghandlingpracticesare
recommended:
a) Devicesshouldbehandledonbencheswithconductiveandgroundedsurfaces.
b) Groundtestequipment,toolsandoperator.
c) Donothandledevicesbytheleads.
d) Storedevicesinconductivefoamorcarriers.
e) Avoiduseofplastic,rubber,orsilkinMOSareas.
f) Maintainrelativehumidityabove50percentifpractical.
g) ForCI-CGApackages,usespecifictraytotakecareofthehighestheightofthe
packagecomparedwiththeregularCBGA.
10
11
12
13
12
TCK
TDI, TMS
TDO
TDO
TDO
INPUT DATA VALID
OUTPUT DATA VALID
OUTPUT DATA VALID