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參數資料
| 型號： | W27E010S-90 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 128Kx8 EEPROM |
| 中文描述： | 128K X 8 EEPROM 12V, 90 ns, PDSO32 |
| 封裝： | 0.450 INCH, SOP-32 |
| 文件頁數： | 13/15頁 |
| 文件大小： | 194K |
| 代理商： | W27E010S-90 |
W27E010
Publication Release Date: June 2000
- 13 -
Revision A6
PACKAGE DIMENSIONS
32-pin P-DIP
Seating Plane
e
A
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
32
1
16
17
1. Dimensions D Max. & S include mold flash or
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
4. Dimension B1 does not include dambar
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
Notes:
1.37
1.22
0.054
0.048
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.540
0.555
0.550
13.84
14.10
13.97
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
1
e
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
15
0
32-pin SO Wide Body
1
17
32
16
y
e
D
S
Seating Plane
b
A
A
E H
L
L
E
E
1
c
e
1
1
e
A
2
See Detail F
Detail F
1. Dimensions D Max. & S include mold flash
3. Dimensions D & E in.
4. Controlling dimension: Inches.
5. General appearance spec should be based
Notes:
Symbol
Min.
Nom.
Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
b
c
D
E
e
H
E
L
L
E
S
y
1
2
0.118
3.00
0
10
10
0
0.20
0.15
0.008
0.006
0.012
0.31
0.004
0.101
0.014
0.106
0.016
0.111
0.020
2.57
0.36
0.10
2.69
0.41
2.82
0.51
0.047
0.004
0.805
0.055
0.817
0.063
1.19
20.45
1.40
20.75
1.60
0.556
0.556
0.546
14.38
14.12
13.87
0.10
11.43
11.30
11.18
0.450
0.445
0.440
0.58
0.79
0.99
0.023
0.031
0.039
1.12
1.27
1.42
0.044
0.050
0.056
0.91
0.036
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