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參數(shù)資料
| 型號： | W523S12 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | 音頻合成 |
| 英文描述： | HIGH FIDELITY PowerSpeech-TM |
| 中文描述： | 12 SEC, SPEECH SYNTHESIZER, UUC19 |
| 文件頁數(shù)： | 11/14頁 |
| 文件大?。?/td> | 90K |
| 代理商： | W523S12 |
W523SXX
(PRELIMINARY)
Publication Release Date: Oct 2000
- 11 -
Revision A5
I
OL1
I
OH1
I
OL2
I
OH2
V
DD
= 3V, Vout = 0.4V
V
DD
= 3V, Vout = 2.7V
V
DD
= 3V, Rl = 8
0.8
-0.8
100
-100
mA
mA
mA
mA
Output Current of
STPA-STPE
Output Current of
SPK+, SPK-
AC CHARACTERISTICS
PARAMETER
SYM.
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Ring oscillator, Rosc = 270 K
Ring oscillator, Rosc = 560 K
Ring Oscillator, Rosc = 1.2 M
Ring Oscillator, Rosc = 2.4 M
2.7
3
3.3
MHz
Oscillation Frequency
(
W58300
ICE chip)
Fosc1
1.3
1.5
1.7
MHz
2.7
3
3.3
MHz
Oscillation Frequency
(
W523Sxx
production
chip)
Fosc2
1.3
1.5
1.7
MHz
Oscillation Frequency
Deviation by Voltage
Drop
Fosc2
Fosc2
F(3V)-F(2.4V)
F(3V)
7.5
%
Instruction Cycle Time
Tins
Fosc = 3 MHz, SR = 6 KHz
1/3
mS
POI Delay Time
T
PD
Fosc = 3 MHz
160
mS
Long Debounce Time
T
DEBL
50
mS
Short Debounce Time
T
DEBS
Fosc = 3 MHz, SR = 6 KHz
400
μ
S
BONDING PAD DIAGRAM
19
1
2
3
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W523S15 | HIGH FIDELITY PowerSpeech-TM |
| W523S20 | HIGH FIDELITY PowerSpeech-TM |
| W523S25 | HIGH FIDELITY PowerSpeech-TM |
| W523S30 | HIGH FIDELITY PowerSpeech-TM |
| W523S40 | HIGH FIDELITY PowerSpeech-TM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W523S15 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:HIGH FIDELITY PowerSpeech-TM |
| W523S20 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:HIGH FIDELITY PowerSpeech-TM |
| W523S25 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:HIGH FIDELITY PowerSpeech-TM |
| W523S30 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:HIGH FIDELITY PowerSpeech-TM |
| W523S40 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:HIGH FIDELITY PowerSpeech-TM |
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