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參數資料
| 型號： | W52900 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | 音頻合成 |
| 英文描述： | ADPCM Voice Synthesizer(ADPCM話音合成器) |
| 中文描述： | SPEECH SYNTHESIZER, PDIP24 |
| 封裝： | SKINNY, DIP-24 |
| 文件頁數： | 8/8頁 |
| 文件大小： | 105K |
| 代理商： | W52900 |
W52900
- 8 -
BONDING PAD DIAGRAM
RESET
OSC
V
SPK
(0,0)
V
IO5
IO2
IO3
IO4
IO6
TG3
TEST
TG1
TG2
TG4
IO7
WRP
DATA
RDP
IO8/FTEST
IO1
V
SS
DD
SS
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792697
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27516023
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Note: All data and specifications are subject to change without notice.
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