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參數資料
| 型號： | A3P600-FGG144 |
| 廠商： | Microsemi SoC |
| 文件頁數： | 13/27頁 |
| 文件大小： | 0K |
| 描述： | IC FPGA 235I/O 144FBGA |
| 標準包裝： | 160 |
| 系列： | ProASIC3 |
| RAM 位總計： | 110592 |
| 輸入/輸出數： | 97 |
| 門數： | 600000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 144-LBGA |
| 供應商設備封裝： | 144-FPBGA（13x13） |
| 其它名稱： | 1100-1034 |
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www.microsemi.com/soc
FPGA Design
FlashPro4, ULINK, J-LINK
Hardware Interfaces
MSS Configuration – Analog Configuration
MSS Configurator*
Design Entry and IP Libraries
Simulation and Synthesis
Compile and Layout
Timing and Power Analysis
Hardware Debug
Embedded Design
Software IDE
(SoftConsole, Keil, IAR)
Drivers and Sample Projects
Application Development
Build Project
Simulation
Software Debug
Microsemi
Design
Environment
Design Environment for Microsemi Flash Devices
* MSS configurator is specific to the SmartFusion design flow.
Microsemi’s Libero Integrated Design Environment (IDE) is a comprehensive
software toolset for designing with all Microsemi FPGAs. Libero IDE includes
industry-leading synthesis, simulation and debug tools from Synopsys
and Mentor Graphics, as well as innovative timing and power optimization
and analysis.
Microsemi’s SmartDesign tool simplifies the use of Microsemi IP in user
designs as well as offering a simple way to build on-chip processors with
custom peripherals. Most Microsemi IP cores are now included by default
in Libero IDE as either obfuscated or RTL versions, depending on the
license selected.
For embedded designers, Microsemi offers FREE SoftConsole Eclipse-based
IDE for use with ARM Cortex-M1, Cortex-M3 and Core8051s, as well as
evaluation versions from Keil and IAR Systems. Full versions are available
from respective suppliers.
For SmartFusion cSoCs, the MSS configurator creates a bridge between
the FPGA fabric and embedded designs, so device configuration can be
easily shared among multiple developers. The MSS configurator allows
the designer to choose peripherals, assign configuration settings and
change I/O attributes. Most importantly, the memory map is automatically
generated according to the user’s selections, along with all the required
firmware for the selected configuration. The memory map and firmware are
imported into the software project, whether it is GNU, Keil or IAR.
FPGA Design Support
Embedded Design Support
Platform Support
Libero IDE Licenses
Gold(FREE)
Platinum
Platinum Evaluation
Standalone
Device Support
All families
Up to 1,500,000 gates
All devices
Microsemi IP
Obfuscated
RTL
Obfuscated
RTL
Synthesis
Synplify Pro AE
x
Simulation
ModelSim AE
x
Debug
Identify AE
x
Microsemi Debug
x
Program File
x
Microsemi
Keil
IARSystems
SoftConsole
Keil MDK
EmbeddedWorkbench
FreeVersionsfromMicrosemi
Free with Libero IDE
32 K Code Limited
AvailablefromVendor
N/A
Full version
Compiler
GNU GCC
RealView C/C++
IAR ARM Compiler
Debugger
GDB Debug
Vision Debugger
C-SPY Debugger
Instruction Set Simulator
No
Vision Simulator
Yes
DebugHardware
FlashPro4
ULink2 or ULINK-ME
J-Link or J-Link Lite
Tool
Libero IDE
SoftConsole
Keil
IAR
FlashPro
WindowsXPProfessional
Now
WindowsVistaBusiness
andWindows7
Now
RedHatLinuxWS5.0,5.2
Now
N/A
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相關代理商/技術參數 |
參數描述 |
|---|---|
| A3P600-FGG144ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P600-FGG144I | 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
| A3P600-FGG144PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P600-FGG256 | 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
| A3P600-FGG256I | 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17） |
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