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參數資料
| 型號： | SE98ATP,547 |
| 廠商： | NXP Semiconductors |
| 文件頁數： | 38/43頁 |
| 文件大?。?/td> | 849K |
| 描述： | IC TEMP SENSOR DDR 8-HWSON |
| 產品培訓模塊： | I²C Bus Fundamentals |
| 標準包裝： | 1 |
| 功能： | 溫度監控系統（傳感器） |
| 傳感器類型： | 內部 |
| 感應溫度： | -40°C ~ 125°C |
| 精確度： | ±4°C（最小值） |
| 拓撲： | ADC（三角積分型），寄存器庫 |
| 輸出類型： | I²C?/SMBus? |
| 輸出警報： | 是 |
| 輸出風扇： | 是 |
| 電源電壓： | 1.7 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤 |
| 供應商設備封裝： | 8-WSON |
| 包裝： | 標準包裝 |
| 產品目錄頁面： | 847 (CN2011-ZH PDF) |
| 其它名稱： | 568-4731-6 |
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SE98A_4
?NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 25 November 2009
38 of 43
NXP Semiconductors
SE98A
DDR memory module temp sensor, 1.7 V to 3.6 V
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 Surface mount reflow
soldering description .
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
" Through-hole components
" Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
" Board specifications, including the board finish, solder masks and vias
" Package footprints, including solder thieves and orientation
" The moisture sensitivity level of the packages
" Package placement
" Inspection and repair
" Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
" Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
" Solder bath specifications, including temperature and impurities
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相關代理商/技術參數 |
參數描述 |
|---|---|
| SE98PW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SO-DIMM SMBus/I2C-bus temperature sensor |
| SE98PW,118 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| SE98PW-T | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC TS DIMM RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| SE98TK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DDR memory module temp sensor, 3.3 V |
| SE98TK,118 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
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