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參數(shù)資料
| 型號(hào)： | SE98ATP,547 |
| 廠商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 39/43頁(yè) |
| 文件大小： | 849K |
| 描述： | IC TEMP SENSOR DDR 8-HWSON |
| 產(chǎn)品培訓(xùn)模塊： | I²C Bus Fundamentals |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 功能： | 溫度監(jiān)控系統(tǒng)（傳感器） |
| 傳感器類型： | 內(nèi)部 |
| 感應(yīng)溫度： | -40°C ~ 125°C |
| 精確度： | ±4°C（最小值） |
| 拓?fù)洌?/td> | ADC（三角積分型），寄存器庫(kù) |
| 輸出類型： | I²C?/SMBus? |
| 輸出警報(bào)： | 是 |
| 輸出風(fēng)扇： | 是 |
| 電源電壓： | 1.7 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 8-WSON |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 產(chǎn)品目錄頁(yè)面： | 847 (CN2011-ZH PDF) |
| 其它名稱： | 568-4731-6 |
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SE98A_4
?NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 25 November 2009
39 of 43
NXP Semiconductors
SE98A
DDR memory module temp sensor, 1.7 V to 3.6 V
13.4 Reflow soldering
Key characteristics in reflow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 31
) than a SnPb process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
and 29
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 31
.
Table 28. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
e 350
< 2.5
235
220
e 2.5
220
220
Table 29. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SE98PW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SO-DIMM SMBus/I2C-bus temperature sensor |
| SE98PW,118 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| SE98PW-T | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC TS DIMM RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| SE98TK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:DDR memory module temp sensor, 3.3 V |
| SE98TK,118 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 2OC RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
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