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參數(shù)資料
| 型號： | TSXPC750AVGSU12LH |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁數(shù)： | 15/44頁 |
| 文件大小： | 870K |
| 代理商： | TSXPC750AVGSU12LH |
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15
TSPC750A/740A
2128A–HIREL–01/02
ThermalCharacteristics
Theboarddesignercanchoosebetweenseveraltypesofheatsinkstoplaceonthe
TSPC750A.Thereareseveralcommercially-availableheatsinksfortheTSPC750A
providedbythefollowingvendors:
Fortheexposed-diepackagingtechnology,showninTable5,theintrinsicconduction
thermalresistancepathsareasfollows:
Thediejunction-to-case(ortop-of-dieforexposedsilicon)thermalresistance
Thediejunction-to-ballthermalresistance
Figure6depictstheprimaryheattransferpathforapackagewithanattachedheatsink
mountedtoaprinted-circuitboard.
Heatgeneratedontheactivesideofthechipisconductedthroughthesilicon,then
throughtheheatsinkattachmaterial(orthermalinterfacematerial),andfinallytothe
heatsinkwhereitisremovedbyforced-airconvection.
Sincethesiliconthermalresistanceisquitesmall,forafirst-orderanalysis,thetempera-
turedropinthesiliconmaybeneglected.Thus,theheatsinkattachmaterialandthe
heatsinkconduction/convectivethermalresistancesarethedominantterms.
Figure6.
C4PackagewithHeatSinkMountedtoaPrinted-CircuitBoard
ThermalManagement
Assistance
TheTSPC750Aincorporatesathermalmanagementassistunit(TAU)composedofa
thermalsensor,digital-to-analogconverter,comparator,controllogic,anddedicated
special-purposeregisters(SPRs).Specificationsforthethermalsensorportionofthe
TAUarefoundinTable6.Moreinformationontheuseofthisfeatureisgiveninthe
MPC750ARISCMicroprocessorUser’smanual.
Table5.
PackageThermalCharacteristics
Characteristic
Symbol
Value
Rating
CBGAandCI-CGApackagesthermalresistance,junction-to-casethermalresistance
(typical)
θ
JC
0.03
°
C/W
CBGApackagethermalresistance,diejunction-to-leadthermalresistance(typical)
θ
JB
θ
JB
3.8
°
C/W
CI-CGApackagethermalresistance,diejunction-to-leadthermalresistance(typical)
4
°
C/W
External Resistance
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed ± Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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