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參數資料

TSPC750A/740A

2128A–HIREL–01/02

AdhesivesandThermal

InterfaceMaterials

Figure8.

ThermalPerformanceofSelectThermalInterfaceMaterial

Athermalinterfacematerialisrecommendedatthepackagelid-to-heatsinkinterfaceto

minimizethethermalcontactresistance.Forthoseapplicationswheretheheatsinkis

attachedbyspringclipmechanism,Figure8showsthethermalperformanceofthree

thin-sheetthermal-interfacematerials(silicone,graphite/oil,floroetheroil),abarejoint,

andajointwiththermalgreaseasafunctionofcontactpressure.Asshown,theperfor-

manceofthesethermalinterfacematerialsimproveswithincreasingcontactpressure.

Theuseofthermalgreasesignificantlyreducestheinterfacethermalresistance.Thatis,

thebarejointresultsinathermalresistanceapproximately7timesgreaterthanthether-

malgreasejoint.

Heatsinksareattachedtothepackagebymeansofaspringcliptoholesintheprinted-

circuitboard(seeFigure7).Thisspringforceshouldnotexceed5.5poundsofforce.

Therefore,thesyntheticgreaseoffersthebestthermalperformance,consideringthe

lowinterfacepressure.

Theboarddesignercanchoosebetweenseveraltypesofthermalinterface.Heatsink

adhesivematerialsshouldbeselectedbaseduponhighconductivity,yetadequate

mechanicalstrengthtomeetequipmentshock/vibrationrequirements.

0.5

1.5

Silicone Sheet (0.006 inch)

Bare Joint

Floroether Oil Sheet (0.007 inch)

Graphite/Oil Sheet (0.005 inch)

Synthetic Grease

Contact Pressure (psi)

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