- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄22053 > SPAKDSP321VF275 (Freescale Semiconductor)IC DSP 24BIT 196-MAPBGA PDF資料下載
參數(shù)資料
| 型號： | SPAKDSP321VF275 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 59/84頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DSP 24BIT 196-MAPBGA |
| 標準包裝： | 2 |
| 系列： | DSP56K/Symphony |
| 類型： | 定點 |
| 接口： | 主機接口，SSI，SCI |
| 時鐘速率： | 275MHz |
| 非易失內(nèi)存： | ROM（576 B） |
| 芯片上RAM： | 576kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.60V |
| 工作溫度： | -40°C ~ 100°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 196-LBGA |
| 供應(yīng)商設(shè)備封裝： | 196-MAPBGA（15x15） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁當前第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁
DSP56321 Technical Data, Rev. 11
4-2
Freescale Semiconductor
Design Considerations
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
If the temperature of the package case (TT) is determined by a thermocouple, thermal resistance is
computed from the value obtained by the equation (TJ – TT)/PD.
As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using the first
definition. From a practical standpoint, that value is also suitable to determine the junction temperature from a case
thermocouple reading in forced convection environments. In natural convection, the use of the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will
yield an estimate of a junction temperature slightly higher than actual temperature. Hence, the new thermal metric,
thermal characterization parameter or
ΨJT, has been defined to be (TJ – TT)/PD. This value gives a better estimate of
the junction temperature in natural convection when the surface temperature of the package is used. Remember that
surface temperature readings of packages are subject to significant errors caused by inadequate attachment of the
sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-
gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
4.2 Electrical Design Considerations
Use the following list of recommendations to ensure correct DSP operation.
Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the
board ground to each GND pin.
Use at least four 0.01–0.1
F bypass capacitors for V
CCQL (core) and at least six 0.01–0.1
F bypass
capacitors for the other VCC (I/O) power connections positioned as closely as possible to the four sides of
the package to connect the power sources to GND.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and GND pins
are less than 0.5 inch per capacitor lead.
Use at least a four-layer PCB with two inner layers for VCC and GND.
Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal. This
recommendation particularly applies to the address and data buses as well as the IRQA, IRQB, IRQC, IRQD,
TA
, and BG pins. Maximum PCB trace lengths on the order of 6 inches are recommended.
CAUTION
This device contains protective circuitry to
guard against damage due to high static
voltage or electrical fields. However, normal
precautions are advised to avoid application
of any voltages higher than maximum rated
voltages
to
this
high-impedance
circuit.
Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage
level (for example, either GND or VCC).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TPSC686M016R0125 | CAP TANT 68UF 16V 20% 2312 |
| F930J156MAA | CAP TANT 15UF 6.3V 20% 1206 |
| KMC8144SVT1000A | IC DSP 783FCPBGA |
| B82496C3221J | INDUCTOR 220NH .11A 0603 5% |
| TPSC686K010R0100 | CAP TANT 68UF 10V 10% 2312 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SPAKDSP321VL240 | 功能描述:IC DSP 24BIT 240MHZ 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:DSP56K/Symphony 標準包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| SPAKDSP321VL275 | 功能描述:IC DSP 24BIT 275MHZ 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:DSP56K/Symphony 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| SPAKDSP56824BU70 | 制造商:Freescale Semiconductor 功能描述: |
| SPAKF56009FJ81 | 制造商:Motorola Inc 功能描述: |
| SPAKMC331CFC16 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:User’s Manual |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。