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| 型號： | SPAKDSP311VF150 |
| 廠商： | Freescale Semiconductor |
| 文件頁數： | 70/96頁 |
| 文件大小： | 0K |
| 描述： | IC DSP 24BIT 196-MAPBGA |
| 標準包裝： | 2 |
| 系列： | DSP56K/Symphony |
| 類型： | 定點 |
| 接口： | 主機接口，SSI，SCI |
| 時鐘速率： | 150MHz |
| 非易失內存： | ROM（576 B） |
| 芯片上RAM： | 384kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.80V |
| 工作溫度： | -40°C ~ 100°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 196-LBGA |
| 供應商設備封裝： | 196-MAPBGA（15x15） |
| 包裝： | 托盤 |
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DSP56311 Technical Data, Rev. 8
4-2
Freescale Semiconductor
Design Considerations
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
If the temperature of the package case (TT) is determined by a thermocouple, thermal resistance is
computed from the value obtained by the equation (TJ – TT)/PD.
As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using the first
definition. From a practical standpoint, that value is also suitable to determine the junction temperature from a case
thermocouple reading in forced convection environments. In natural convection, the use of the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will
yield an estimate of a junction temperature slightly higher than actual temperature. Hence, the new thermal metric,
thermal characterization parameter or
Ψ
JT, has been defined to be (TJ – TT)/PD. This value gives a better estimate
of the junction temperature in natural convection when the surface temperature of the package is used. Remember
that surface temperature readings of packages are subject to significant errors caused by inadequate attachment of
the sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a
40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
4.2 Electrical Design Considerations
Use the following list of recommendations to ensure correct DSP operation.
Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the
board ground to each GND pin.
Use at least four 0.01–0.1
F bypass capacitors for the core and PLL power and six 0.01–0.1 F bypass
capacitors for I/O power positioned as closely as possible to the four sides of the package to connect the
VCC power source to GND.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and GND pins
are less than 0.5 inch per capacitor lead.
Use at least a four-layer PCB with two inner layers for VCC and GND.
CAUTION
This device contains protective circuitry to
guard against damage due to high static
voltage or electrical fields. However, normal
precautions are advised to avoid application
of any voltages higher than maximum rated
voltages
to
this
high-impedance
circuit.
Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage
level (for example, either GND or VCC).
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| SPAKDSP311VL150 | 功能描述:IC DSP 24BIT 150MHZ 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:DSP56K/Symphony 標準包裝:2 系列:StarCore 類型:SC140 內核 接口:DSI，以太網，RS-232 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，FCBGA 供應商設備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| SPAKDSP321VF240 | 功能描述:IC DSP 24BIT 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:DSP56K/Symphony 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，FCBGA 供應商設備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| SPAKDSP321VF275 | 功能描述:IC DSP 24BIT 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:DSP56K/Symphony 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，FCBGA 供應商設備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| SPAKDSP321VL240 | 功能描述:IC DSP 24BIT 240MHZ 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:DSP56K/Symphony 標準包裝:2 系列:StarCore 類型:SC140 內核 接口:DSI，以太網，RS-232 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，FCBGA 供應商設備封裝:431-FCPBGA（20x20） 包裝:托盤 |
| SPAKDSP321VL275 | 功能描述:IC DSP 24BIT 275MHZ 196-MAPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:DSP56K/Symphony 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，FCBGA 供應商設備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
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